View MSL-1947HB3-S_4190594.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

Surface Mount Chip LEDs
Description
The MSL-1947HB3, a BLUE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaN on Sapphire LED chip technology and water clear epoxy package.
MSL-1947HB3-S
Package Dimensions
Applications
l l l l
Small Size (Extra Thin) Industry Standard Footprint(0603) Compatible with IR Solder process Availalble in 8 mm Tape on 7"(178mm) Diameteer Reels
Features
l l l l
Recommended Solder Patterns
Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Panel Indicator
NOTE: 1. All dimensions are in millimeter (inches) 2. Tolerance is 0.15mm (.006") unless otherwise specified.
Absolute Maximum Ratings
@ TA=25 C Parameter Peak Forward Current(1/10 Duty Cycle@1KHz ) DC Forward Current Power Dissipation Reverse Voltage Electrostatic Discharge Threshold (HBM) Note A Operating Temperature Range Storage Temperature Range
Note A : HBM(Human Body Model)
o
Symbol IFP IF PD VR EOT TOPR TSTG
Maximum Rating 100 30 125 5 300 -25 C to +80 C -30oC to +100oC
o o
Unit mA mA mW V V
Unity Opto Technology Co., Ltd.
10/16/2003
MSL-1947HB3-S
Optical-Electrical Characteristics
@ TA=25oC Item Luminous Intensity Forward Voltage Dominant Wavelength Threshould Voltage Reverse Voltage Reverse Current Conditions IF=10mA IF=5mA IF=20mA IF=10uA IR=10uA VR=5V Symbol IV VF d Vth VR IR Min . 23 2.70 465 2.0 10.0 Typ . Max . 39 3.20 475 2.6 50.0 Unit . mcd V nm V V A
Typical Optical-Electrical Characteristic Curves
Relative Luminous Intensity Forward Current IF(mA)
1 30 25 20 15 10 5 0 0 1 2 3 4
0.5
0 380 450 520 590 660
Forward Current IF (mA)
40 30 20 10 0 0 25 50 75
o
Relative Luminous Intensity Normalized at IF=20mA
Wavelength (nm) FIG.1 RELATIVE INTENSITY LUMINOUS VS. WAVELENGTH
Forward Voltage (V) FIG.2 FORWARD CURRENT VS. FORWARD VOLTAGE
1.50 1.25 1.00 0.75 0.50 0.25 0.00 0 5 10 15 20 25 30
100
Ambient Temperature ( C) FIG.3 FORWARD CURRENT VS. AMBIENT TEMPERATURE Relative Luminous Intensity Relative Luminous Intensity
10
Forward Current IF (mA) FIG.4 RELATIVE LUMINOUS INTENSITY VS. FORWARD CURRENT
0o 10o 20o 30 40 1.0 0.9 0.8 0.5 0.3 0.1 0.2 0.4 0.6 50 60 70 80 90
1
0.1
Ambient Temperature (oC) FIG.5 LUMINOUS INTENSITY VS. AMBIENT TEMPERATURE
0
25
50
75
FIG.6 RADIATION DIAGRAM
Unity Opto Technology Co., Ltd.
10/16/2003
MSL-1947HB3-S
RANK MARKING
Forward Voltage Rank Markings Min A 2.75 VF (Volts) @IF = 5mA Max 2.85 Min Luminous Intensity Iv(mcd) IF=10mA Max Dominant Wavelength ld(nm) IF=20mA Min Max
B
2.85
2.95 23.00 35.00 465.0 470.0
C
2.95
3.05
D E
3.05 3.15
3.15 3.25
These values measured by Optical Spectrum Analyzer of UnityOpto Co., Ltd and tolerances are followings as below -Luminous Intensity(Iv):20%, Forward Voltage(VF)=5%, Wave Length:1nm
Unity Opto Technology Co., Ltd.
10/16/2003
MSL-1947HB3-S
GaN LED HANDLING PRECAUTION The blue LED is a device that is very sensitive to serge voltage produced when static electricity is discharged.Handling with sufficient care is needed to prevent damage to a chip or a drop in its reliability. Also, the same handling care is needed when applying voltage over the absolute maximum rating. (Be aware of serge voltage produced when you turn the on-off switch) How to prevent electrical charge and discharge during operation If the person who is electrically charged touches the part, there is a possibility of electric discharge toward the semiconductor device which may destroy the part, if the part is electrically charged inductively by the surroundings,or the part is electrically charged by friction and touches metal, the part may discharge static and cause damage. During your operations,please take these countermeasures written below. 1. Do not let material which is electrically chaged get close to the part. (Avoid contact with metal when the part is electrically charged) 2. Avoid any friction process with the part 3. Be sure to ground all manufacturing machines and measuring instruments if possible 4. Make an anti-static environment, such as placing electrically conductive mat (below 106 )or using anti-static equipment such as static blow Let the worker wear the anti-static wrist strap, (Electrical resistance of 250K-1M must be placed in series to avoid an electric shock.) Working Environment In case of semiconductor device, static occurs easily in dry condition . Especially the surface mount led should be kept in a dry environment to avoid moisture absorbency .But a relative humidity of 50% or more is recommended for the process after the soldering . Static level should be kept under 300V at your working area.
Unity Opto Technology Co., Ltd.
10/16/2003
MSL-1947HB3-S
RECOMMENDED SOLDERING CONDITION
Reflow Soldering.
Temperature-Profile
Temp 2.5~5oC / sec.
o
o 240-245 C 240o 10-40sC o 183 C
Max. 5sec. Max.
2.5~5 C / sec.
Pre-heating 120~150oC 120 to180 s 40sec. Max. Above 200oC
Ramp-up rate down to 6 K/s
Defined for Preconditioning:up to 6 K/s Ramp-up rate up to 6 K/s 120sec. Max. Defined for Preconditioning:2-3 K/s
Time
Unity Opto Technology Co., Ltd.
10/16/2003
MSL-1947HB3-S
Recommended Soldering Conditions
1.Reflow Soldering (1).The Fig. 1 temperature profile shall be at the surface of LED resin. (2).Number of reflow process shall be less than 2 times. If second reflow process would be performed,intervals between first and second process shall be as short as possible to prevent absorption of moisture to resin of LED Cooling process to nomal temp,shall be required between first and second refiow process (3).Temp,fluctuation to LED at pre-heat process shall be minimized.(Less than 6oC)
2.Dip Soldering (1).Preheat temp,for soldering:120-150oC ,60-120sec (2).Soldering temp:Temp of soldering pot 260 MAX.less than 5sec (3).Number of dip soldering process shall be less than 2 times and these process shall be performed in a row. Cooling process to normal temp, shall be required between first and second soldering process.
3.Other Caution (1).Manual soldering should be less than 280oC within 3 sec. (2).Heat or UV(or both)curing resin shall used for preliminary fixing. Curing condition or temp,:150oC MAX.less than 120sec (3).Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temp,after soldering (4).If manual soldering would be performed to repair LED by tweezers, mechanical force to resin should not be given
Unity Opto Technology Co., Ltd.
10/16/2003
MSL-1947HB3-S
Tape Dimensions Pocessive direction
REEL Dimensions
Unity Opto Technology Co., Ltd.
10/16/2003
MSL-1947HB3-S
Packaging
Loaded quantity per reel : 4000 pcs / reel
Product lable: CUSTOMER: CUSTOMER P/N: DEVICE TYPE: BIN: LOT NO: Q'TY: DATE:
STORAGE PERIOD: Damp-proofbag un-opened: 6 month max. Temperature: 5 to 30oC; humidity:70%RH, max; 6 month max. STORAGE PRECAUTIONS: After open the laminate bag the lamps should be storage in the follow condition: Temperature: 5 to 30oC; humidity:70%RH, max; storage time: 72hrs max Baking condition: If backing is necessary, we recommended the backing condition is 60+/- 5oC 10hours
Packing Box
Loaded quantity per box : 24,000 pcs / box
Product lable: CUSTOMER: CUSTOMER P/N: DEVICE TYPE: BIN: LOT NO: Q'TY: DATE:
Unity Opto Technology Co., Ltd.
10/16/2003
MSL-1947HB3-S
Reel Packing Direction of take out
Items Cover Leader Tape Carrier Tape Traiier Empty Pockets
Specifications Cover tape shall be longer than 200 mm without carrier tape There will be more than 10 empties There will be more than 15 empties There will be a maximum of 3 empty component pockets
Remarks The end of the tape shall be adhered to tape The orientation of tape is as shown
The end of the tape is inserted into a slit of the hub The maximum connecting pockets in the middle of carriertape
Unity Opto Technology Co., Ltd.
10/16/2003
MSL-1947HB3-5
Surface Mount Moisture Sensitivity Specifications
1. Controlling Moisture
Unity Opto Technology, in its design of packing materials and packing methods, takes into consideration the susceptibility of some Unity packages to moisture induced damage. The risk of this damage is caused when the LED lens plastic encapsulation material is exposed to increases or decreases in the Relative Humidity of the surrounding environment.
Such damage may include delamination between the die and the LED lens plastic encapsulation material, which may result in open connections due to broken wire bonds. Moisture in the package having reached a critical level will fracture the package in order to escape when exposed to peak temperature conditions, typical in soldering practices.
Therefore, the control of moisture levels in the LED package is critical to reduce the risk of moisture-induced failures. Please follow JEDEC-STD-033A standards for handling moisture sensitive devices.
2. Packaging SMD devices:
Unity packages all SMD devices into dry pack bags (moisture barrier bags).
Unity includes a desiccant pouch in each bag. Testing confirms that the desiccant pouch greatly reduces the presence of moisture by maintaining the environment in the bag, thus protecting the devices during shipment and storage.
3. Handling Dry Packed Parts
Upon receipt, the bags should be inspected for damage to ensure that the bag's integrity has been maintained. Inspection should verify that there are no holes, gouges, tears, or punctures of any kind that may expose the contents of the bag.
To open the bag, simply cut across the top of the bag as close to the original seal as possible being careful not to damage the contents. Once open the desired quantity of units should be removed and the bag resealed. If the bag is left open longer than 2 hours, the desiccant pouch should be replaced with a dry desiccant and the bag should be sealed immediately to avoid moisture damage.
Unity Opto Technology Co., Ltd.
10/16/2003

▲Up To Search▲

Price & Availability of MSL-1947HB3-S

	To Download MSL-1947HB3-S Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .